Ceramic Column Grid Array Design And Manufacturing Rules For Flight Hardware

Document ID 
GSFC-STD-6001
Document Date 
02/22/2011

The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free ceramic column grid array solder joint interconnects to boards intended for use in space flight applications (refer to Appendix A, Technology Background). This standard does not provide application specific reliability test requirements (e.g. qualification requirements).